LINKYTECH TECHNOLOGY
It is our aim to provide a quality of service that can support our customers and bring their products into production.
SI/PI/EMC analysis
Signal Integrity
Experience of handling prelayout & postlayout designs/topologies helps customer to first time right designs.
Successfully executed complex Multidrop/Multipoint topologies.
Asserting PCB layer stackup/Layer ordering/PCB materials based on SI results.
Validating the logic level, Drive strengths, Termination techniques, Thresholds, Over/Under shoot, Propagation Delay, Noise margin etc., Slew Rate, Timing Budget(setup/Hold time), EYE Diagram.、
BER, ISI, Jitter, Loss(IL,RL) analysis.
Cross talk analysis and mitigation methodologies.
SerDes/DDRx/XAUI/PCIe interfaces.
Handled upto 12.5Gb speed.
SI-Signal Integrity
Signal Integrity
Prelayout & postlayout designs/topologies
BER, ISI, Jitter, Loss(IL,RL) analysis.
Cross talk analysis
Timing Budget(setup/Hold time), EYE Diagram
Complex Multidrop/Multipoint topologies
PI-Power Integrity
Power Integrity
IR/DC Drop analysis
Voltage/Current Density
3D plots Decoupling Analysis with Frequency
V/S Impedance plotPlane
Noise Analysis with 3D plot of plane noise
EMC
EMC Analysis
Frequency V/S dB plot for Different standards
RE/CE analysis
RI/CI analysis
3D Magnetic/Electric & Current density Plots
Noise Analysis with 3D plot of plane noise
DFM-Design for Manufacture
Design for manufacture
DFM Analysis
DFA Analysis
DFT Analysis
信號Signal Integrity
Experience of handling prelayout & postlayout designs/topologies helps customer to first time right designs.
Successfully executed complex Multidrop/Multipoint topologies.
Asserting PCB layer stackup/Layer ordering/PCB materials based on SI results.
Validating the logic level, Drive strengths, Termination techniques, Thresholds, Over/Under shoot, Propagation Delay, Noise margin etc., Slew Rate, Timing Budget(setup/Hold time), EYE Diagram.
BER, ISI, Jitter, Loss(IL,RL) analysis.
Cross talk analysis and mitigation methodologies.
SerDes/DDRx/XAUI/PCIe interfaces.
Handled up to 12.5Gb speed.
| Analysis Item | |
|---|---|
| Layer | 2-64L |
| Thickness | 0.5-17.5mm |
| Min M | 0.1mm |
| Hole | 3mil |
| HDI | 1+n+1\2+n+2\3+n+3 |
Power Integrity analysis
Design For Fabrication Anaysis
The DFF is a process of optimizing the design data so that it can be the manufactured at least cost without sacrificing the design intent.
DFA Analysis helps you to resolve manufacturability issues, increases reliability,
reduces rework cost and most importantly helps you to meet “TIME TO MARKET”
